Agenda and Speakers


In the future, companies will increasingly be held accountable for human rights and child labor. According to OR 964 Swiss companies have to conduct due diligence in the supply chain and report thereon regarding child labor. The board of directors must prepare an annual report on the compliance with these due diligence obligations. If you want to learn more, come and join this hybrid session


  • Magali Anderson, Chief Sustainability and Innovation Officer, Holcim Ltd.
  • Prof. Dr. Christine Kaufmann, Chair at OECD Working Party on Responsible Business Conduct, Centre for Human Rights Studies, University of Zurich

The event will be conducted in English. Participants are invited to discuss in their languages.


Board members and CEOs interested in joining the sessions, can register here: 

The initiators and facilitators of Responsible Impact Boards

Chapter Zero Switzerland, engageability and the Global Compact Network Switzerland & Liechtenstein in collaboration with ESG Competent Boards and the Swiss Board School are organizing the event within the framework of the Responsible Impact Boards program. It designed by and for board members to embrace a future-fit mindset, address key sustainability issues and think ahead.

The Responsible Impact Boards program is led by professionals with sustainability credentials and long-standing business experience. We are motivated to facilitate workshops for responsible impact boards or complement the composition of your board and offer access to cutting-edge tools & resources.


  • Barbara Dubach, Founder & CEO engageability
  • Antonio Hautle Executive Director Global Compact Network Switzerland & Liechtenstein
  • Prof. Dr. Michael Hilb Co-chair, Chapter Zero Switzerland

This event is organized in cooperation with the Federal Department of Foreign Affairs (FDFA) and the State Secretariat for Economic Affairs (SECO). It is part of measure 3 “Promotion of UN Guiding Principles” of the Swiss National Action Plan on Business and Human Rights 2020-2023. For more information, please refer to: